Invention Patent
JP2010121194A Additive for forming porous plating film and method of forming porous plating film
有权
形成多孔镀膜的添加剂和形成多孔镀膜的方法
- Patent Title: Additive for forming porous plating film and method of forming porous plating film
- Patent Title (中): 形成多孔镀膜的添加剂和形成多孔镀膜的方法
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Application No.: JP2008298201Application Date: 2008-11-21
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Publication No.: JP2010121194APublication Date: 2010-06-03
- Inventor: HORIKAWA MAKOTO , TAKAHASHI CHIE , YAMATO SHIGERU
- Applicant: Okuno Chem Ind Co Ltd , 奥野製薬工業株式会社
- Assignee: Okuno Chem Ind Co Ltd,奥野製薬工業株式会社
- Current Assignee: Okuno Chem Ind Co Ltd,奥野製薬工業株式会社
- Priority: JP2008298201 2008-11-21
- Main IPC: C25D3/02
- IPC: C25D3/02 ; C25D3/12 ; C25D3/38
Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming a homogeneous and excellent porous coating film by carrying out an inexpensive process applied to various base materials without using a specific apparatus. SOLUTION: The additive for an electroplating bath for forming the porous plating film comprises a water soluble quaternary ammonium compound having hydrophobic group. The method of forming the porous plating film is carried out by electroplating in the electroplating bath containing the additive. COPYRIGHT: (C)2010,JPO&INPIT
Public/Granted literature
- JP5366076B2 Porous plating film for electroplating bath containing a porous plating film-forming additives Public/Granted day:2013-12-11
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