PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which can increase the number of laminates easily by using a laminate after it is laminated on a supporting substrate and separated therefrom as a pseudo-core substrate.SOLUTION: The method of manufacturing a multilayer wiring board includes a step of forming an intermediate laminate by laminating resin insulating layers 20-23 and conductor layers 30-32 alternately on a planar supporting substrate 11, a step of separating the intermediate laminate and the supporting substrate 11 after the surface side thereof is subjected entirely to metal plating, and a step of forming a wiring lamination part by laminating the resin insulating layers and conductor layers alternately for the separated laminate 10b. Consequently, a multilayer wiring board where the number of laminates can be increased easily as compared with a conventional coreless wiring board can be obtained.