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公开(公告)号：JP2013149941A
公开(公告)日：2013-08-01
申请号：JP2012217107
申请日：2012-09-28
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , HANTO TAKUYA , SUGIMOTO ATSUHIKO , HIRANO SATOSHI , SAIKI HAJIME
IPC: H05K3/46
CPC classification number: H05K3/4623 , H05K1/0298 , H05K3/0035 , H05K3/0097 , H05K3/4673 , H05K3/4682 , H05K2203/0156 , H05K2203/061 , H05K2203/1536 , Y10T156/1057
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate having a laminated structure in which at least one layer of a conductor layer and at least one layer of a resin insulation layer are alternately laminated on both surfaces of a core substrate, which achieves a reduced thickness of a core substrate and achieves a compact size without deteriorating manufacturing yield; and provide a manufacturing method of the multilayer wiring substrate.SOLUTION: A multilayer wiring substrate comprises: a first stacked structure which includes at least one layer of a conductor layer and at least one layer of a resin insulation layer; a core substrate which is laminated on the first laminated structure and which includes reinforce fibers of the internal capsule; and a second laminated structure which includes at least one layer of a conductor layer and at least one layer of a resin insulation layer and which is formed on the core substrate. A plurality of via conductors are formed to pierce each of the resin insulation layer of the first laminated structure, the core substrate and the resin insulation layer of the second laminated structure in a thickness direction, and all of the via conductors are increased in diameter in the same direction. The reinforce fibers are positioned above the center of the core substrate in a thickness direction.
Abstract translation: 要解决的问题：提供一种层叠结构的多层布线基板，其中至少一层导体层和至少一层树脂绝缘层交替地层叠在芯基板的两个表面上，其实现了减小的 核心基板的厚度并且实现紧凑的尺寸而不降低制造成品率; 并提供多层布线基板的制造方法。解决方案：多层布线基板包括：第一层叠结构，其包括至少一层导体层和至少一层树脂绝缘层; 核心基板，其层叠在第一层叠结构上，并且包括内部胶囊的增强纤维; 以及第二层叠结构，其包括至少一层导体层和至少一层树脂绝缘层，并且形成在芯基板上。 多个通路导体形成为在厚度方向上穿透第一层叠结构体的树脂绝缘层，第二层压结构体的芯基板和树脂绝缘层，并且所有通孔导体的直径都增加 方向相同 加强纤维在厚度方向上位于芯基板的中心的上方。
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公开(公告)号：JP2013135080A
公开(公告)日：2013-07-08
申请号：JP2011284389
申请日：2011-12-26
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , HANTO TAKUYA , SUGIMOTO ATSUHIKO , HIRANO SATOSHI , SAIKI HAJIME
IPC: H05K3/46
CPC classification number: H05K3/10 , H05K3/0035 , H05K3/0097 , H05K3/4673 , H05K3/4682 , H05K2203/0156 , H05K2203/061 , H05K2203/1536 , Y10T29/49124 , Y10T29/49155
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer wiring board which prevents the deterioration of the manufacturing yield, reduces a thickness of a core substrate, and achieves the downsizing in the multilayer wiring board having laminated structures, where at least one conductor layer and at least one resin insulation layer are alternately laminated, on both surfaces of the core substrate.SOLUTION: A first lamination structure, in which at least one conductor layer and at least one resin insulation layer are alternately laminated, is laminated on a support substrate, and a core substrate is formed so as to contact with the conductor layer positioned at a top layer of the first lamination structure. Next, through holes are formed by radiating laser light to the core substrate, and a metal layer is formed in each through hole. Subsequently, a second lamination structure, including at least one conductor layer and at least one resin insulation layer, is formed on the core substrate. At that time, a thickness of the conductor layer at the top layer of the first lamination structure is set so as to be larger than thicknesses of the other conductor layers.
Abstract translation: 要解决的问题：为了提供防止制造成品率的劣化的多层布线板的制造方法，降低芯基板的厚度，并且实现具有层叠结构的多层布线板的小型化，其中至少一个导体 层和至少一个树脂绝缘层交替地层叠在芯基板的两个表面上。解决方案：将至少一个导体层和至少一个树脂绝缘层交替层叠的第一层压结构层压在支撑件 基板和芯基板形成为与位于第一层叠结构的顶层的导体层接触。 接下来，通过向芯基板照射激光形成通孔，并且在每个通孔中形成金属层。 随后，在芯基板上形成包括至少一个导体层和至少一个树脂绝缘层的第二层压结构。 此时，将第一层叠结构体的顶层的导体层的厚度设定为大于其他导体层的厚度。
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公开(公告)号：JP2013123035A
公开(公告)日：2013-06-20
申请号：JP2012198437
申请日：2012-09-10
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , HANTO TAKUYA , SUGIMOTO ATSUHIKO , HIRANO SATOSHI , SAIKI HAJIME
IPC: H05K3/46
CPC classification number: H05K3/0097 , H05K3/0035 , H05K3/4682 , H05K2203/0156 , H05K2203/061 , H05K2203/1536 , Y10T29/49155
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method capable of downsizing a multilayer wiring board having a laminate structure in which at least one conductive layer and at least one resin insulating layer are alternately laminated on both surfaces of a core substrate by thinning the core substrate.SOLUTION: A manufacturing method for a multilayer wiring board comprises the steps of: forming a first laminate structure including at least one conductive layer and at least one resin insulating layer on a support substrate; laminating a core substrate in which a metal layer is disposed on an upper principal surface on the first laminate structure so that a lower principal surface of the core substrate comes into contact with the first laminate structure; and forming a second laminate structure including at least one conductive layer and at least one resin insulating layer on the core substrate so as to cover the metal layer.
Abstract translation: 解决的问题：提供一种能够使具有叠层结构的多层布线基板的小型化的制造方法，其中至少一个导电层和至少一个树脂绝缘层通过变薄交替层压在芯基板的两个表面上 核心基板。 解决方案：多层布线板的制造方法包括以下步骤：在支撑基板上形成包括至少一个导电层和至少一个树脂绝缘层的第一层压结构; 在第一层叠结构的上主表面上层压配置有金属层的芯基板，使得芯基板的下主面与第一层叠结构体接触; 以及在所述芯基板上形成包括至少一个导电层和至少一个树脂绝缘层的第二叠层结构，以覆盖所述金属层。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2008244000A
公开(公告)日：2008-10-09
申请号：JP2007080089
申请日：2007-03-26
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： SUZUKI TETSUO , IGAI NORIHIKO , MORI SEIJI , TOKUDA TAKUYA
Abstract: PROBLEM TO BE SOLVED: To provide the method of suppressing the slipping of dissolution solder between a resist layer and a pad.
SOLUTION: The method of manufacturing a wiring substrate 10 includes: a substrate precursor portion 20, a pad 30a/b, a solder resist layer 40a/b covering the periphery of the pad, and a solder member 50a/b formed on a non-coated portion which is not covered with the solder resist 40a/b of the pad 30a/b. The method sequentially includes: a step of adhering a curable resin composition which serves as the solder resist layer 40a/b after curing to the front surfaces of the pad 30a/b and the substrate precursor portion 20, and thereby forming a curable resin composition layer; the step of removing a portion which is at least a non-coated portion of the curable resin composition layer, and thereby forming a pattern layer; the step of photo-curing the pattern layer, and then heat-curing the pattern layer, and thereby forming the solder resist layer 40a/b; and the step of forming a bump 50a/b on the non-coated portion of the pad 30a/b.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供抑制溶解焊料在抗蚀剂层和焊盘之间滑动的方法。 解决方案：制造布线基板10的方法包括：基板前体部分20，焊盘30a / b，覆盖焊盘周边的阻焊层40a / b和形成在焊盘上的焊料部件50a / b 没有被焊盘30a / b的阻焊层40a / b覆盖的未涂覆部分。 该方法依次包括：将固化后的作为阻焊层40a / b的固化性树脂组合物粘合到焊盘30a / b的前表面和基板前体部20的工序，从而形成固化性树脂组合物层 ; 除去作为固化性树脂组合物层的至少未涂布部分的部分的步骤，从而形成图案层; 对图案层进行光固化的步骤，然后对图案层进行热固化，从而形成阻焊层40a / b; 以及在焊盘30a / b的未涂覆部分上形成凸块50a / b的步骤。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2004327771A
公开(公告)日：2004-11-18
申请号：JP2003121264
申请日：2003-04-25
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： ISHIKAWA SATOSHI , YOSHIOKA KOJI , SUZUKI TETSUO
CPC classification number: H01L2224/16225
Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board, wherein the connection reliability of solder can be enhanced as to the wiring board to the board body of which electronic components or terminals are fixed by way of the solder.
SOLUTION: The wiring board 101 is provided with the board body 110 having connection pads 149; and an IC chip 191 fixed to the connection pads 149 via a major side solder 153. The manufacturing method includes the steps of heating and melting the major side solder 153 on the connection pads 149, to bring the connection pads 149 and IC terminals 193 of the IC chip 191 to a state where they are immersed in the major side solder 153; thereafter quenching the major side solder 153 for a temperature region during solidification of the solder; and gradually cooling the major side solder 153 for a temperature region, after the end of solidification of the solder to join the IC chip 191 to the connection pads 149.
COPYRIGHT: (C)2005,JPO&NCIPI-
Patent Agency Ranking
公开(公告)号：JP2012222209A
公开(公告)日：2012-11-12
申请号：JP2011087760
申请日：2011-04-11
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： SUZUKI TETSUO , SHIIBA YUKI , SAIKI HAJIME , HIRANO SATOSHI
Abstract: PROBLEM TO BE SOLVED: To inject and charge, in a component mounted board on which a component is mounted via a terminal pad exposed on a surface of the board, a sufficient amount of seal resin to between the surface of the board and the component without generating a void.SOLUTION: In a component mounted board, a first groove portion is formed between a pair of terminal pads exposed on a surface of the board and extends in a cross direction that intersects with a first arrangement direction in which terminal pads constituting the pair of terminal pads are arranged. A width of the first groove portion in the first arrangement direction is widened from a center portion thereof toward an end portion thereof.
Abstract translation: 要解决的问题：通过暴露在板表面上的终端焊盘将安装有部件的部件安装板注入和充电，将足够量的密封树脂施加到板的表面和 该组件不产生空隙。 解决方案：在组件安装板中，在暴露在板的表面上的一对端子焊盘之间形成第一槽部，并且在与构成该对的端子焊盘的第一排列方向相交的横向方向上延伸 的端子排布置。 第一排列方向上的第一槽部的宽度从其中央部向其端部变宽。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2012222208A
公开(公告)日：2012-11-12
申请号：JP2011087759
申请日：2011-04-11
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： SUZUKI TETSUO , SHIIBA YUKI , HIRANO SATOSHI , SAIKI HAJIME
Abstract: PROBLEM TO BE SOLVED: To inject and charge, in a wiring board on which an electronic component is mounted via a terminal pad exposed on a surface of the board, a sufficient amount of seal resin to between the surface of the board and the electronic component without generating a void.SOLUTION: In a component mounted board, a groove portion is formed to extend in a cross direction that intersects with a first arrangement direction in which terminal pads constituting a pair of terminal pads are arranged. A width of the groove portion in the first arrangement direction is narrowed from a center portion thereof toward an end portion thereof. The center portion of the groove portion is formed in a position corresponding to a center of a component in the cross direction.
Abstract translation: 要解决的问题：通过暴露在板表面上的终端焊盘将电子部件安装在布线基板上进行充电，将足够量的密封树脂填充到板的表面和 该电子部件不产生空隙。 解决方案：在组件安装板中，形成沟槽部分沿与其中布置有一对端子焊盘的端子焊盘的第一布置方向相交的横向方向延伸。 第一排列方向上的槽部的宽度从其中央部朝向其端部变窄。 槽部的中心部形成在与横向成分的中心对应的位置。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2011199077A
公开(公告)日：2011-10-06
申请号：JP2010065254
申请日：2010-03-19
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , HIRANO SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board which can increase the number of laminates easily by using a laminate after it is laminated on a supporting substrate and separated therefrom as a pseudo-core substrate.SOLUTION: The method of manufacturing a multilayer wiring board includes a step of forming an intermediate laminate by laminating resin insulating layers 20-23 and conductor layers 30-32 alternately on a planar supporting substrate 11, a step of separating the intermediate laminate and the supporting substrate 11 after the surface side thereof is subjected entirely to metal plating, and a step of forming a wiring lamination part by laminating the resin insulating layers and conductor layers alternately for the separated laminate 10b. Consequently, a multilayer wiring board where the number of laminates can be increased easily as compared with a conventional coreless wiring board can be obtained.
Abstract translation: 要解决的问题：提供一种多层布线板的制造方法，其可以通过层叠在支撑基板上之后使用层压体而容易地增加层叠体的数量，并将其从假芯基板分离。解决方案： 制造多层布线板包括通过在平面支撑基板11上交替层叠树脂绝缘层20-23和导体层30-32而形成中间层压体的步骤，在表面之后分离中间层压体和支撑基板11的步骤 其侧面完全进行金属电镀，以及通过层叠树脂绝缘层和导体层而形成布线层叠部的步骤用于分离的层压体10b。 因此，与传统的无芯布线板相比，能够容易地增加层叠体的数量的多层布线基板。
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公开(公告)号：JP2011171397A
公开(公告)日：2011-09-01
申请号：JP2010031864
申请日：2010-02-16
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , HIRANO SATOSHI
CPC classification number: H05K3/4682 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K1/113 , H05K3/205 , H05K2201/09745 , H05K2201/099 , H05K2203/0361 , H05K2203/0369 , H05K2203/0588 , Y10T29/302 , Y10T29/49117 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate with high reliability by preventing a resin insulation layer from cracking. SOLUTION: A plurality of openings 35 and 36 are formed in the resin insulation layer 24 on a top-surface-31 side of a wiring laminate portion 30, and a plurality of openings 37 are formed in a resin insulation layer 20 on a bottom-surface-32 side. A plurality of connection terminals 41, 42 and 45 are disposed corresponding to the openings 35, 36 and 37. Outer peripheral portions of terminal outer surfaces 41a and 42a of the connection terminals 41 and 42 are covered with the resin insulation layer 24, and outer peripheral portions of terminal outer surfaces 45a of the connection terminals 45 are covered with the resin insulation layer 20. Each of the second-main-surface-side connection terminals 45 has a recessed portion 45b at the center of the terminal outer surface 45a, and the deepest portion of the recessed portion 45b is located on the interior layer side in relation to the outer peripheral portion of the terminal outer surface 45a. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：通过防止树脂绝缘层开裂来提供高可靠性的多层布线基板。 解决方案：在布线层叠部分30的顶表面31侧的树脂绝缘层24中形成多个开口35和36，并且在树脂绝缘层20中形成多个开口37 底面32侧。 多个连接端子41,42和45相对于开口35,36和37设置。连接端子41和42的端子外表面41a和42a的外围部分被树脂绝缘层24覆盖，外部 连接端子45的端子外表面45a的周边部分被树脂绝缘层20覆盖。每个第二主表面侧连接端子45在端子外表面45a的中心具有凹部45b，并且 凹部45b的最深部相对于端子外表面45a的外周部位于内层一侧。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2011155251A
公开(公告)日：2011-08-11
申请号：JP2010285410
申请日：2010-12-22
Applicant: Ngk Spark Plug Co Ltd , 日本特殊陶業株式会社
Inventor： MAEDA SHINNOSUKE , SUZUKI TETSUO , SUGIMOTO ATSUHIKO , ITO TATSUYA , HANTO TAKUYA , HIRANO SATOSHI
CPC classification number: H05K3/3452 , H01L23/49811 , H01L23/49822 , H01L2924/0002 , H05K1/113 , H05K3/205 , H05K3/383 , H05K3/4682 , H05K2201/068 , H05K2201/094 , H05K2201/09527 , H05K2201/099 , H05K2203/0346 , H05K2203/0369 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a high-reliability multilayered wiring substrate capable of sufficiently improving adhesion strength of a connection terminal.
SOLUTION: In this multilayered wiring substrate 10, IC chip connection terminals 41 and capacitor connection terminals 42 are formed on the upper surface 31 of a wiring lamination part 30, and mother substrate connection terminals 45 are formed on the undersurface 32 side. A plurality of openings 37 are formed on a resin insulation layer 21 on the undersurface 32 side of the wiring lamination part 30. The mother substrate connection terminals 45 are embedded in the openings 37, and terminal outer surfaces 45a thereof are located on an inner layer side relative to a surface 21a of the resin insulation layer 21.
COPYRIGHT: (C)2011,JPO&INPITAbstract translation: 要解决的问题：提供能够充分提高连接端子的粘附强度的高可靠性多层布线基板。 解决方案：在该多层布线基板10中，在布线层叠部30的上表面31上形成有IC芯片连接端子41和电容连接端子42，在下表面32侧形成有母基板连接端子45。 多个开口37形成在布线层叠部30的下表面32侧的树脂绝缘层21上。母基板连接端子45嵌入开口37中，端子外表面45a位于内层 侧面相对于树脂绝缘层21的表面21a。版权所有（C）2011，JPO＆INPIT
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