Invention Patent
- Patent Title: Multilayer ceramic electronic component and manufacturing method therefor
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: JP2011061984Application Date: 2011-03-22
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Publication No.: JP2012199353APublication Date: 2012-10-18
- Inventor: OGAWA MAKOTO , MOTOKI AKIHIRO , SARUKUI MASATO , OGAWA WATARU
- Applicant: Murata Mfg Co Ltd , 株式会社村田製作所
- Assignee: Murata Mfg Co Ltd,株式会社村田製作所
- Current Assignee: Murata Mfg Co Ltd,株式会社村田製作所
- Priority: JP2011061984 2011-03-22
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01F27/29 ; H01F41/10 ; H01G4/12 ; H01G4/232 ; H03H7/01
Abstract:
PROBLEM TO BE SOLVED: To enable formation of a continuous plating film at least as a portion of an external electrode to connect between exposed terminals of a plurality of internal electrodes, even when each gap between adjacent exposed terminals of the internal electrodes is wide.SOLUTION: A component body 2 having a plurality of ceramic layers 95 and the plurality of internal electrodes 91-93, in which each portion of the plurality of internal electrodes is exposed, is formed to have conductive regions 96-98 with diffused formation of conductive components included in the internal electrodes, on the end face of the ceramic layer 95 located between the neighboring exposed terminals of the plurality of internal electrodes. The ceramic layer is preferably composed of a glass ceramic including a glass component of 10 wt.% or more. To form external electrodes 3-6, the plating film is directly formed on the component body 2 by plating-growing the exposed terminals of the internal electrodes and the conductive regions as a core of plating deposition.
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