PROBLEM TO BE SOLVED: To provide a manufacturing method capable of downsizing a multilayer wiring board having a laminate structure in which at least one conductive layer and at least one resin insulating layer are alternately laminated on both surfaces of a core substrate by thinning the core substrate.SOLUTION: A manufacturing method for a multilayer wiring board comprises the steps of: forming a first laminate structure including at least one conductive layer and at least one resin insulating layer on a support substrate; laminating a core substrate in which a metal layer is disposed on an upper principal surface on the first laminate structure so that a lower principal surface of the core substrate comes into contact with the first laminate structure; and forming a second laminate structure including at least one conductive layer and at least one resin insulating layer on the core substrate so as to cover the metal layer.