Invention Patent
- Patent Title: Joint structure and bonding method as well as the wiring board and manufacturing method thereof
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Application No.: JP2008534188Application Date: 2006-09-14
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Publication No.: JP5109977B2Publication Date: 2012-12-26
- Inventor: 敏秋 中馬
- Applicant: 住友ベークライト株式会社
- Assignee: 住友ベークライト株式会社
- Current Assignee: 住友ベークライト株式会社
- Priority: JP2006318279 2006-09-14
- Main IPC: H05K3/46
- IPC: H05K3/46
Public/Granted literature
- JPWO2008032386A1 接合部構造および接合方法ならびに配線板およびその製造方法 Public/Granted day:2010-01-21
Information query
