Invention Patent
- Patent Title: Semiconductor device, a method of manufacturing a semiconductor circuit substrate and the semiconductor circuit board
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Application No.: JP2010178431Application Date: 2010-08-09
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Publication No.: JP5601079B2Publication Date: 2014-10-08
- Inventor: 尚希 小坂 , 宗山 天清 , 康 金谷
- Applicant: 三菱電機株式会社
- Assignee: 三菱電機株式会社
- Current Assignee: 三菱電機株式会社
- Priority: JP2010178431 2010-08-09
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L21/331 ; H01L21/822 ; H01L23/12 ; H01L25/10 ; H01L25/11 ; H01L25/18 ; H01L27/04 ; H01L29/737
Public/Granted literature
- JP2012038951A Semiconductor circuit board and manufacturing method thereof, and semiconductor device Public/Granted day:2012-02-23
Information query
IPC分类:
