Sectional dimensions ± 0.5 mm square columnar silicon block silicon ingot was cut formed by a wire saw, a grinding ability to process the perpendicularity of the corner portion 0.1 ° ±, within the tolerance range of the cut formed grinding and polishing device of the silicon block having a polishing function capable of removing the surface layer of the micro-cracks in the silicon block (W) and providing the processed method.
And gripping means for gripping a silicon block (W) (1), and measuring means for measuring the cross-sectional dimensions of the silicon block (W) (2), the flat portion of the silicon block (W) (F) and the corners ( and grinding means for grinding the C) (3), the flat portion of the grinding completion silicon block (W) (F) and the corner portion (C) a polishing means for removing the polished to microcracks and (4) , actuating said gripping means (1) a measuring means gripping silicon block (W) (2), and grinding means (3), transfer means for transferring between the grinding means (4) (5), each of said means is thereby provided control means (6).