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KR1020150087334A 금속-세라믹스 접합 기판 및 그 제조 방법 审中-实审
金属陶瓷接合基板及其制造方法

금속-세라믹스 접합 기판 및 그 제조 방법
摘要：
질화알루미늄소결체로이루어지는세라믹스기판(10)의잔류응력이 -50㎫이하, 세라믹스기판(10)의금속판(14)과의접합면의산술평균조도(Ra)가 0.15∼0.30㎛, 10점평균조도(Rz)가 0.7∼1.1㎛, 최대높이(Ry)가 0.9∼1.7㎛, 세라믹스기판(10)의항절강도가 500㎫이하, 세라믹스기판(10)의표면을따라형성되는잔류응력층(10a)의두께가 25㎛이하로되도록, 액체중에지립으로서구상알루미나를포함하는슬러리를세라믹스기판(10)의표면에분사하는웨트블라스트처리를행한후, 이웨트블라스트처리에의해얻어진세라믹스기판(10)에브레이징재(12)를개재하여구리또는구리합금으로이루어지는금속판(14)을접합함으로써, 세라믹스기판(10)과금속판(14)의접합강도가우수함과함께, 내히트사이클특성이우수한금속-세라믹스접합기판을제조한다.
摘要（英）：

The arithmetic mean roughness of the contact surface between the metal plate 14 of the residual stress of the ceramic substrate 10 made of an aluminum nitride sintered body -50㎫ below, the ceramic substrate 10 (Ra) is 0.15~0.30㎛, 10-point average roughness (Rz) is 0.7~1.1㎛, max height residual stress layer (10a) is (Ry) is formed along the surface of the 0.9~1.7㎛, the transverse rupture strength of the ceramic substrate 10 500㎫ below, the ceramic substrate 10, is the thickness to be equal to or less than 25㎛, the ceramic substrate 10 obtained by the then subjected to wet blast treatment for spraying the slurry containing spherical alumina as an abrasive in a liquid to the surface of the ceramic substrate 10, a wet blast treatment by bonding a metal plate 14 made of copper or a copper alloy via the brazing material 12, the ceramic substrate 10 and with the bond strength of the metal sheet (14) excellent, in the heat cycle property is good metal-ceramic bond a second substrate The.

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