The present invention method for manufacturing electronic equipment for producing electronic products using semiconductors, displays, solar cells, multi-layer type carrier film and device transfer method using the same for transferring the elements to be mounted sensor or the like as a target substrate in a source substrate and a method relates to a, multi-layer film type carrier according to the invention and a base film, and a strained layer, including the hard layer, and the device transfer method using the same includes a picking step, a curing step, and a flat racing step. Multilayer carrier film and this device transfer method according to the invention is a device in the source substrate to a multilayer carrier film and adhesive as a primary, a strained layer multilayer carrier film through the hardness changes in the configured in the multi-layer type carrier film and controlling the adhesive force between the elements will be characterized by an adhesive element adhered to the secondarily the multi-layer type carrier film on the target substrate. Further, electronics manufacturing method for manufacturing an electronic product using a device transfer method using a multi-layer type carrier film of the present invention using the device transfer method using a multilayer carrier film to transfer the plurality of elements on the flat panel electronic a it characterized in that it produced.