本发明系提供一种耐热性及对于树脂之相溶性优异、可使树脂之耐热性充分地提高之化合物，具体而言系提供一种下述通式(1)所表示之化合物。式(1)中，R 1 ~R 4 表示C1~12烷基或C6~12芳基，y表示1~2000之数，X 1 表达式(2)或(3)所表示之基。式(2)中，R 5 表示氢原子、O‧、C1~12烷基或C1~12烷氧基，L 1 表示C1~6伸烷基或C6~12伸芳基。式(3)中，R 6 表示C1~4烷基或C6~12芳基，X 2 表达式(2)所表示之基或氢原子，s表示2~6之数，L 2 表示C1~6伸烷基或C6~12伸芳基，s个X 2 中之至少1个为式(2)所表示之基：

The present invention provides a compound which has excellent heat resistance and compatibility with a resin and which can satisfactorily improve the heat resistance of a resin, and more specifically provides a compound represented by general formula (1). In formula (1), R1 to R4 each denote an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, y denotes a number between 1 and 2,000, and X1 denotes a group represented by formula (2) or formula (3). In formula (2), R5 denotes a hydrogen atom, O, an alkyl group having 1 to 12 carbon atoms or an alkoxy group having 1 to 12 carbon atoms, and L1 denotes an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 12 carbon atoms. In formula (3), R6 denotes an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 12 carbon atoms, X2 denotes a group represented by formula (2) or a hydrogen atom, s denotes a number between 2 and 6, L2 denotes an alkylene group having 1 to 6 carbon atoms or an arylene group having 6 to 12 carbon atoms, and at least one of s X2 groups is a group represented by formula (2).