本发明系一种油脂状或煳状之硬化性有机聚硅氧烷组成物，其系含有：(A)于1分子中具有2个以上键结于硅原子之烯基的有机聚硅氧烷、(B)于1分子中具有2个以上键结于硅原子之氢原子的有机氢聚硅氧烷、(C)熔点为0~70℃之镓及/或其之合金、(D)平均粒径为0.1~100μm之热传导性充填剂、(E)铂系触媒、及(G)下述通式(1) (式中，R1为相同或相异种之一价之烃基，R2为烷基、烷氧基、烯基或酰基，a为5~100之整数，b为1~3之整数)所表示之聚硅氧烷。本发明之硬化性有机聚硅氧烷组成物，于硬化前为油脂状或煳状，故于IC封装等之发热性电子零件上涂布之际之作业性良好。

A curable organopolysiloxane composition in grease or paste form, which including: (A) an organopolysiloxane having at least two alkenyl groups bonded to silicon atom in one molecule; (B) an organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicone atom in the molecule; (C) gallium and/or a gallium alloy having a melting point of 0 to 70 DEG C.; (D) a thermally conductive filler having an average particle size of 0.1 to 100 [mu]m; (E) a platinum-based catalyst; and (F) a polysiloxane of the following general formula (1): wherein R1 may be the same or different and represents a monovalent hydrocarbon group, R2 represents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.