本发明系一种接合设备，其特征为：跨壳体5A、工具基座13以及接合工具14设置芯片吸引通路23；当对芯片吸引通路23供给负压时，便可将半导体芯片3吸附保持于接合工具14的底面；工具基座13系由透光构件11、12堆栈所构成，借由形成在透光构件12的顶面上的沟部12B与中心部位的贯通孔12A构成作为芯片吸引通路23的主要部位的连接通路29。本发明之功效为：在利用激光光L将半导体芯片3加热并接合于基板2上时，即使附着于凸块35的助焊剂等物质蒸发而附着于连接通路29内，由于沟部12B的设置范围较小，故可防止因为助焊剂等物质而导致激光光L的透光率降低。

A chip suction channel 23 is provided across a housing 5A, a tool base 13, and a bonding tool 14. By applying a negative pressure to the chip suction channel 23, a semiconductor chip 3 can be suctioned and held on the lower surface of the bonding tool 14. The tool base 13 is configured as a laminate of light-permeable members 11 and 12, and a connection channel 29 which constitutes a major part of the chip suction channel 23 is formed by a groove 12B formed in the top surface of the permeable member 12 and a through-hole 12A formed in the center. When bonding the semiconductor chip 3 to the substrate 2 by heating the chip with a laser light L, even if some of the flux or the like attached to bumps 35 evaporates and adheres to the inside of the connection channel 29, because the groove 12B only occupies a small area, any reduction in the transmittance of the laser light L due to the flux or the like can be prevented.