本发明揭露一种方法与设备，适用于使用一微凸块层在一中介层上形成一半导体设备封装体。上述微凸块层可包含微凸块与微凸块线，其中一微凸块是用于一芯片与上述中介层之间的一垂直连接，而一微凸块线是用于位在上述中介层的上方的不同芯片之间的信号传输所使用的水平连接。上述微凸块线可以与上述微凸块同时形成，具有低成本或未增加成本。

Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost.