一种半导体单元包含一芯片，在其前表面具有左行接触件与右行接触件。互连垫片系提供于该芯片的前表面上方，并例如经由导线或包含打线的安排来连接至该接触件中的至少一些。该互连垫片单独或该互连垫片及该接触件中的一些提供一外部连接构件数组。这个数组包含一些反向外部连接构件对，其中，连接或集成该右接触件的外部连接构件系置放于集成或连接至该左接触件之外部连接构件的左边。这类单元可被使用于一多芯片封装内，例如，具有面向上地朝着一封装基板的第一芯片和面向下地朝着该基板的第二芯片的二芯片封装，该基板被置放于该芯片下方。该反向连接简化绕线，尤其是在该二芯片的相对应接触件欲连接至该封装基板上的共同终端所在处。

A semiconductor unit includes a chip having left and right columns of contacts at its front surface. Interconnect pads are provided overlying the front surface of the chip and connected to at least some of the contacts as, for example, by traces or by arrangements including wire bonds. The interconnect pads alone, or the interconnect pads and some of the contacts, provide an array of external connection elements. This array includes some reversal pairs of external connection elements in which the external connection element connected to or incorporating the right contact is disposed to the left of the external connection element incorporating or connected to the left contact. Such a unit may be used in a multi-chip package such as a two-chip package having a first chip facing upwardly and a second chip facing downwardly towards a package substrate, disposed below the chips. The reversed connections simplify routing, particularly where corresponding contacts of the two chips are to be connected to common terminals on the package substrate.