本发明揭示一种用于在一晶粒十取进程中提供对准之方法，该方法可包含：基于一参考晶粒对准一半导体晶圆；借由沿着跨越该晶圆延伸之一线十取若干个晶粒来相对于该参考晶粒形成一指示线；及使用该参考线来监视十取机器相对于该晶圆之一位置。一晶粒附接机器可包含用于自动实施此方法之一控制系统。

A method for providing alignment in a die picking process may include aligning a semiconductor wafer based on a reference die, forming an indicator line relative to the reference die by picking a number of dice along a line extending across the wafer, and using the reference line to monitor a position of the picking machine relative to the wafer. A die attach machine may include a control system for automatically implementing such method.