本发明揭示一种微电子总成，其包含一基板，该基板具有一第一表面及远离该第一表面之一第二表面。一微电子组件上覆该第一表面上且第一导电组件系曝露于该第一表面及该第二表面中之一者处。该等第一导电组件中之某些第一导电组件电连接至该微电子组件。线接合具有结合至该等导电组件之基底及远离该基板及该等基底之端表面，每一线接合界定在该基底与该端表面之间延伸的一边缘表面。一囊封层自该第一表面延伸且填充该等线接合之间的空间以使得该等线接合借由该囊封层分离。该等线接合之未经囊封部分系由不被该囊封层覆盖之该等线接合之该等端表面之至少部分界定。

A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer.