本发明提供一种合金凸块的制造方法。该方法为了制造合金凸块，在基板(10)上形成具有露出该基板(10)的开口部(13)的抗蚀图案(12)，在开口部(13)内的基板(10)上形成凸块下金属(11)，通过电镀在凸块下金属(11)上形成第一镀膜(14)，通过电镀在第一镀膜(14)上形成不含第一镀膜(14)所含金属成分的第二镀膜(15)，除去抗蚀图案(12)，通过对基板(10)实施热处理使第一镀膜(14)和第二镀膜(15)合金化而形成合金凸块(16)。

The present invention provides a method for manufacturing alloy bump, comprising forming a resistant pattern (12) on a substrate (10) and is exposed from an opening (13) of the substrate (10); forming an under bump metal (11) in the opening (13) of the substrate (10) and forming a first plating film (14) on the under bump metal (11) by plating method; forming a second plating film (15) which does not contain the metal component of the first plating film (14) on the first plating film (14) by plating method and removing the resistant pattern (12); forming alloy bump (16) from the first plating film (14) and the second plating film (15) by heat treatment to the substrate (10).