一种打线接合的方法包括下列步骤。首先，提供基板。基板包括至少一金属垫。接着，设置第一芯片于基板上，且第一芯片包括至少一第一接垫。接着，形成金属球块于对应的金属垫上。接着，由金属球块形成第一导线至对应的第一接垫。接着，进行放电结球制程以形成第一金属熔球于第一导在线。接着，压合连接第一导线的第一金属熔球于对应的第一接垫上，以使第一导线位于第一金属熔球与对应的第一接垫之间。一种应用此打线接合方法的封装结构亦被提出。

A wire bonding method includes the following steps. First, a substrate including at least one metal finger is provided. Next, a first chip including at least one first boding pad is disposed on the substrate. Next, a metal ball bump is formed on the corresponding metal finger. Next, a first wire is formed from the metal ball bump toward the corresponding first boding pad. Next, a first free air ball is formed on the first wire by electronic flame-off process. Then, the first free air ball connected to the first wire is pressed on the corresponding first boding pad, such that the first wire is located between the first free air ball and the corresponding first boding pad. A package structure using the wire bonding method is also provided.