本发明系为解决量产的接合线之FAB所导致之熔融球的形成变 得不安定的上述课题而完成者，目的在提供线的解绕性佳，而且可形成安定的熔融球之用于球焊且披覆钯(Pd)的铜线。 一种用于球焊且披覆钯(Pd)的铜线，其系线径为10~25μm； 在由铜(Cu)或铜合金所成之芯材上形成有钯(Pd)的披覆层之，其中：在该钯(Pd)的披覆层中存在有钯(Pd)单独的无垢层，并且在该钯(Pd)的披覆层上形成有来自该芯材的铜(Cu)的渗出层，且该铜(Cu)的渗出层的表面被氧化。再者，一种用于球焊且披覆钯(Pd)的铜线，其系线径为10~25μm；在铜(Cu)或铜合金所成之芯材披覆有钯(Pd)的披覆层及金(Au)的表皮层，其中：在该金(Au)的表皮层上形成铜(Cu)的渗出层，该铜(Cu)的渗出层的表面被氧化，而且在钯(Pd)的披覆层存在钯(Pd)单独的无垢层。

The present invention is to solve the subject that the molten ball formed unstably whilst in mass production resulting from FAB of the bonding wire, and which has the purpose to provide a palladium (Pd) cladding copper wire that have better de-wiring characteristics to form a ball bonding with stable molten ball. A palladium (Pd) cladding copper ball bonding wire has wire diameter of 10 to 25 [mu]m; the palladium (Pd) cladding layer is formed on a core material prepared by copper (Cu) or copper alloy, wherein, a non-impurity layer only in the presence of palladium (Pd) existx on the Pd cladding layer, and further the palladium (Pd) cladding layer forms a diffusion layer thereon that has a core material of copper (Cu); therefore, the surface of the diffusion layer of copper (Cu) is oxidized. In addition, a palladium (Pd) cladding copper ball bonding wire has wire diameter of 10 to 25 [mu]m; the palladium (Pd) cladding layer and gold (Au) skin layer are formed on a core material prepared by copper (Cu) or copper alloy, wherein, a copper (Cu) diffusion layer is formed on the gold (Au) skin layer, and then the surface of a copper (Cu) diffusion layer is oxidized; a non-impurity layer only in the presence of palladium (Pd) exists on the palladium (Pd) cladding layer.