芯片封装的制造方法包含形成封装导孔结构，此封装导孔结构包含至少一导孔、封装至少一导孔之聚合物层、以及封装聚合物层之第一模料。放置封装导孔结构及第一芯片堆栈于载体上方，此至少一导孔具有接近载体之第一端及远离该载体之第二端。封装第一芯片堆栈及封装导孔结构于第二模料中。形成第一重新分布层于第二模料上方，此第一重新分布层系电性耦接至少一导孔。

A method of manufacturing a die package may include forming an encapsulated via structure including at least one via, a polymer layer encapsulating the at least one via, and a first molding compound encapsulating the polymer layer; placing the encapsulated via structure and a first die stack over a carrier, the at least one via having a first end proximal the carrier and a second end distal the carrier; encapsulating the first die stack and the encapsulated via structure in a second molding compound; and forming a first redistribution layer (RDL) over the second molding compound, the first RDL electrically connecting the at least one via.