揭示一种以封胶体取代基板内核之多芯片封装构造，包含芯片堆栈体、内重配置线路层、芯片互连组件、在内重配置线路层上之金属柱、密封芯片堆栈体与芯片互连组件之封胶体、外重配置线路层以及复数个设置封胶体周边之纵向导通机构。内重配置线路层形成于芯片堆栈体之一主动面上，芯片互连组件具有一超过主动面之线弧段，外重配置线路层完整形成于封胶体之平坦面上。封胶体具有一覆盖于内重配置线路层之覆线厚度，借以密封线弧段与金属柱并使金属柱之端面显露于平坦面，达到省略基板厚度之超薄型芯片堆栈并可应用于封装堆栈设备之功效。

Disclosed is a multi-chip package having encapsulation body to replace substrate core, comprising a chip-stacked combination, an inner RDL, a plurality of chip-interconnecting components, a plurality of metal pillars on the inner RDL, a package body encapsulating the chip-stacked combination and the chip-interconnecting components, an outer RDL and a plurality of vertically-connecting mechanisms installed in the peripheries of the package body. The inner RDL is formed on one of active surfaces of the chip-stacked combination. The chip-interconnecting components have a wire loop section over the active surface. The outer RDL is completely formed on a planar surface of the package body. The package body has wire-encapsulating thickness over the inner RDL, so that the wire loop section and the metal pillars are also encapsulated but the top ends of the metal pillars are exposed from the planar surface. This structure realized the effect of ultra-thin chip stacking by omitting substrate thickness and application of POP device.