一种封装上封装构件，包含有一下芯片封装，包含有：一中介层，其具有一第一面以及相对该第一面的一第二面；至少一芯片，经由复数个凸块安置于该第一面的一芯片安装区域内；一成型模料，设于该第一面，邻近该至少一芯片；复数个周边凸块结构，位于一周边区域内，且贯穿该成型模料，其中各该周边凸块结构包含一埋入在该成型模料内的导电柱体以及一直接堆栈在该导电柱体的部分穿模导孔；复数个锡球，设置于该第二面上；及一上芯片封装，设置于该下芯片封装之上，连接该复数个周边凸块结构。

A package-on-package (PoP) assembly includes a bottom die package and a top die package mounted on the bottom die package. The bottom die package includes an interposer having a first side and a second side opposite to the first side, at least one chip mounted on the first side within a chip mounting area through a plurality of bumps, a molding compound disposed on the first side, the molding compound covering the at least one chip, and a plurality of peripheral bump structures penetrating through the molding compound within the peripheral area. Each of the peripheral bump structures includes conductive pillar and a partial TMV directly stacked on the conductive pillar. A plurality of solder balls is mounted on the second side of the interposer. The top die package is electrically connected to the peripheral bump structures.