一种电子组件封装，包括：框架，具有空腔；电子组件，安置于框架的空腔中；第一金属层，安置于框架的空腔的内壁上；囊封剂，囊封电子组件；以及重分布层，安置于框架及电子组件之下。

An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and the electronic component.