本发明提出一种多晶胞芯片，其中此多晶胞芯片是可使用的。上述的多晶胞芯片可包括半导体基底、多个晶胞以及多个信号传输线组。此些晶胞可配置在半导体基底上。任二相邻晶胞间可具有相隔空间。此些信号传输线组可分别配置在至少部份此些相隔空间上，并可分别用以进行至少部份相邻晶胞间的信号传输。多晶胞芯片可透过部份此些相隔空间进行切割以切断部份此些信号传输线组，致使多晶胞芯片可被分割为多个子芯片，其中切割后的部份子芯片仍可使用。

A multi-cell chip is provided. The multi-cell chip is operable and may include a semiconductor substrate, a plurality of cells and a plurality of signal transmission line sets. The cells are disposed on the semiconductor substrate. A separation space is existed between any adjacent two of the cells. The plurality of signal transmission line sets are respectively disposed in at least part of the separation spaces and respectively configured to perform signal transmission between at least parts of adjacent cells. The multi-cell chip may be cleaved into a plurality of sub-chips by cutting parts of the plurality of signal transmission line sets along parts of the separation spaces, wherein parts of the plurality of sub-chips may still be operable.