本揭露提供指纹传感器封装与方法。实施例包含传感器与传感器表面材料囊封于该指纹传感器封装内。传感器的电极数组的电连接系使用贯穿通路，其系位于传感器中、与传感器分离的连接块中、或是经由连接块，或是经由其他连接而连接，例如线接合。附接高电压晶粒，以增加指纹传感器的灵敏性。

A fingerprint sensor package and method are provided. Embodiments include a sensor and a sensor surface material encapsulated within the fingerprint sensor package. An array of electrodes of the sensor are electrically connected using through vias that are located either in the sensor, in connection blocks separated from the sensor, or through connection blocks, or else connected through other connections such as wire bonds. A high voltage die is attached in order to increase the sensitivity of the fingerprint sensor.