可提供一种半导体封装和/或该半导体封装的制造方法。该半导体封装可包括第一晶粒、电连接至第一晶粒的至少一个第二晶粒以及设置在互链接构层上的多个第一连接器。该半导体封装可包括电连接至所述多个第一连接器的封装基板。该封装基板可具有空腔，所述至少一个第二晶粒被至少部分地设置在所述空腔中。互链接构层可包括电连接至第一晶粒以及所述至少一个第二晶粒的信号路径。所述至少一个第二晶粒可被设置为使信号路径的长度最小化。

A semiconductor package and or method of fabricating the semiconductor package may be provided. The semiconductor package may include a first die, at least one second die electrically connected to the first die, and a plurality of first connectors disposed on the interconnection structure layer. The semiconductor package may include a package substrate electrically connected to the plurality of first connectors. The package substrate may have a cavity and the at least one second die is at least partially disposed in the cavity. The interconnection structure layer may include signal paths electrically connected to the first die and to the at least one second die. The at least one second die may be positioned to minimize a length of the signal paths.