一种封装基板包括第一导电线路层以及绝缘层。第一导电线路层包括相对的第一端部以及第二端部。绝缘层包覆第二端部并填充第一导电线路层所形成的间隙，第一端部的宽度大于第二端部的宽度。绝缘层内开设盲孔，盲孔中形成有导电部。绝缘层上还形成有第二导电线路层。第二导电线路层与绝缘层接触的部分设有一第二铜箔层。第二导电线路层包括临近第二端部设置的第三端部以及与第三端部相对的第四端部。第三端部的宽度大于第四端部的宽度。第一导电线路层和第二导电线路层上形成有防焊层。每一防焊层上开设有开口。

A package substrate includes a first conductive wire layer and an insulating layer. The first conductive wire layer includes a first end portion and an opposite second end portion. The insulating layer wraps the second end portion and fills in gaps formed by the first conductive wire layer. A width of the first end portion is greater than that of the second end portion. The insulating layer defines blind holes. The blind holes include conductive portions. The insulating layer further includes a second conductive wire layer formed thereon. A connecting portion between the second conductive wire layer and the insulating layer includes a second copper layer. The second conductive wire layer includes a third end portion adjacent to the second portion and an opposite fourth end portion. A width of the third end portion is greater than that of the fourth end portion. The first conductive wire layer and the second conductive wire layer include solder mask layers formed thereon. Each solder mask layer defines an opening.