本发明的课题在于对配线材料、绝缘膜材料及阻障金属材料以高速进行研磨，并且减少被研磨面的研磨损伤的产生。本发明的化学机械研磨用水系分散体的一态样含有（A）氧化硅粒子、（B）选自由有机酸及其盐所组成的群组中的至少一种、以及（C）选自由含胺基的硅烷化合物及其缩合物所组成的群组中的至少一种，且pH为7以上且14以下。

An aqueous dispersion for chemical mechanical polishing includes: (A) silica particles; (B) at least one kind selected from the group consisting of organic acids and salts thereof; and (C) at least one kind selected from the group consisting of amino group-containing silane compounds and condensates thereof, and has a pH of 7 or more and 14 or less.