- 专利标题: Packaging material and molded case
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申请号: US14326615申请日: 2014-07-09
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公开(公告)号: US10008700B2公开(公告)日: 2018-06-26
- 发明人: Yuji Minamibori , Honglin Wang
- 申请人: Showa Denko Packaging Co., Ltd.
- 申请人地址: JP Kanagawa
- 专利权人: SHOWA DENKO PACKAGING CO., LTD.
- 当前专利权人: SHOWA DENKO PACKAGING CO., LTD.
- 当前专利权人地址: JP Kanagawa
- 代理机构: Keating and Bennett, LLP
- 优先权: JP2013-156959 20130729
- 主分类号: H01M2/00
- IPC分类号: H01M2/00 ; H01M2/02 ; B29C51/08 ; B29C51/14 ; B32B33/00 ; H01M2/10 ; B29L31/34 ; B32B37/12
摘要:
A packaging material 1 includes a heat resistant resin stretched film layer 2 as an outer layer, a thermoplastic resin layer 3 as an inner layer, a metal foil layer 4 arranged between these layers, and a colored ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin stretched film layer 2. As the heat resistant resin stretched film, a heat resistant resin stretched film having a hot water shrinkage rate of 2% to 20% is used, and the heat resistant resin stretched film layer 2 and the colored ink layer 4 are integrally laminated via an easily adhesive layer 30. In this packaging material, at the time of forming and sealing, and even being used in a somewhat severe environment such as high-temperature and humid environment, the colored ink layer will not be detached from the heat resistant resin stretched film layer.
公开/授权文献
- US20150030910A1 PACKAGING MATERIAL AND MOLDED CASE 公开/授权日:2015-01-29
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