Molding material for package
    4.
    发明授权
    Molding material for package 有权
    包装成型材料

    公开(公告)号:US09553284B2

    公开(公告)日:2017-01-24

    申请号:US14511285

    申请日:2014-10-10

    Abstract: A molding material for package includes a matte-coating layer having excellent formability, chemical resistance, solvent resistance, electrolytic solution resistance and printing property. The molding material for package includes an outer base material layer including a heat-resistant resin; an inner sealant layer including a thermoplastic resin; a metal foil layer disposed between the outer base material layer and the inner sealant layer; and a matte-coating layer formed on a side opposite to the metal foil layer of the outer base material layer, wherein the matte-coating layer is a multilayer including a bottom layer including a resin composition including a main agent resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles; and an upper layer including a resin composition including a fluorine-containing resin.

    Abstract translation: 用于包装的成型材料包括具有优异的成型性,耐化学性,耐溶剂性,耐电解溶液性和印刷性的锍涂层。 用于包装的成型材料包括包含耐热树脂的外基材层; 包含热塑性树脂的内部密封剂层; 设置在所述外基材层和所述内密封层之间的金属箔层; 以及形成在与所述外基材层的金属箔层相反的一侧上的无光泽层,其中所述锍涂层是包含底层的多层,所述底层包括含有苯氧基树脂的主剂树脂的树脂组合物, 聚氨酯树脂,固化剂和固体微粒; 以及包含含有含氟树脂的树脂组合物的上层。

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