- 专利标题: Thermally conductive sheet and method for producing thermally conductive sheet
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申请号: US14962788申请日: 2015-12-08
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公开(公告)号: US10012453B2公开(公告)日: 2018-07-03
- 发明人: Keisuke Aramaki
- 申请人: Dexerials Corporation
- 申请人地址: JP Tokyo
- 专利权人: Dexerials Corporation
- 当前专利权人: Dexerials Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Carmody Torrance Sandak & Hennessey LLP
- 优先权: JP2013-128534 20130619
- 主分类号: B32B3/02
- IPC分类号: B32B3/02 ; F28F21/02 ; C08K3/22 ; C08K3/28 ; C08K7/06 ; H01L23/373 ; B29C47/00 ; B29C47/08 ; F28F21/04 ; F28F21/06 ; C08K3/105 ; B29K83/00 ; B29K105/12 ; B29K105/16 ; B29L31/18
摘要:
A thermally conductive sheet having good thermal conductivity in the thickness direction and a method for producing a thermally conductive sheet. A thermally conductive sheet having a surface with an L* value in a L*a*b color system of 29 or more and 47 or less is obtained by preparing a thermally conductive composition comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, extrusion-molding the thermally conductive composition to obtain a columnar cured product, and cutting the columnar cured product in a direction almost perpendicular to a length direction of a column to a predetermined thickness.
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