Invention Grant
- Patent Title: Semiconductor memory device having rank interleaving operation in memory module
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Application No.: US15371825Application Date: 2016-12-07
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Publication No.: US10013341B2Publication Date: 2018-07-03
- Inventor: Oh-Seong Kwon , Jinhyun Kim , Won-Hyung Song , Jihyun Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC.
- Priority: KR10-2015-0175237 20151209
- Main IPC: G06F12/00
- IPC: G06F12/00 ; G06F12/02 ; G06F3/06 ; G11C8/18 ; G11C5/04 ; G11C7/10 ; G11C8/12 ; G11C11/4076 ; G11C11/408 ; G11C11/4093

Abstract:
A semiconductor memory device includes a first memory area in the semiconductor memory device, and a second memory area in the semiconductor memory device. The second memory area is accessed independently of the first memory area based on a usage selecting signal. The first and second memory areas share command and address lines, and perform a rank interleaving operation based on the usage selecting signal.
Public/Granted literature
- US20170168746A1 SEMICONDUCTOR MEMORY DEVICE HAVING RANK INTERLEAVING OPERATION IN MEMORY MODULE Public/Granted day:2017-06-15
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