Invention Grant
- Patent Title: Ultra high voltage electrostatic discharge protection device with current gain
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Application No.: US15173835Application Date: 2016-06-06
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Publication No.: US10014288B2Publication Date: 2018-07-03
- Inventor: Hsin-Chih Chiang , Tung-Yang Lin , Ruey-Hsin Liu , Ming-Ta Lei
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Hauptman Ham, LLP
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L29/66 ; H01L29/861 ; H01L29/06

Abstract:
A semiconductor device includes a semiconductor substrate. A first semiconductor region is over a portion of the semiconductor substrate to a first depth. A second semiconductor region is in the first semiconductor region. A third semiconductor region is in the first semiconductor region. A fourth semiconductor region is outside the first semiconductor region. A fifth semiconductor region is outside the first semiconductor region to a fifth depth, the fifth semiconductor region being adjacent the fourth semiconductor region. A sixth semiconductor region is below the fifth semiconductor region and to a sixth depth. The sixth depth is equal to the first depth. A first electrode is connected to the third semiconductor region. A second electrode is connected to the fourth and fifth semiconductor regions. The fifth semiconductor region is configured to cause an increase in a current during a cathode to anode positive bias operation between the first and second electrodes.
Public/Granted literature
- US20160284687A1 ULTRA HIGH VOLTAGE ELECTROSTATIC DISCHARGE PROTECTION DEVICE WITH CURRENT GAIN Public/Granted day:2016-09-29
Information query
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