Invention Grant
- Patent Title: Memory structure and manufacturing method for the same
-
Application No.: US15290242Application Date: 2016-10-11
-
Publication No.: US10014306B2Publication Date: 2018-07-03
- Inventor: Chih-Wei Hu , Teng-Hao Yeh
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: TW105113885A 20160504
- Main IPC: H01L27/11519
- IPC: H01L27/11519 ; H01L27/1157 ; H01L21/28 ; H01L27/11524 ; H01L27/11551 ; H01L27/11565 ; H01L27/11578

Abstract:
A memory structure and a manufacturing method for the same are disclosed. The memory structure comprises memory segments. Each of the memory segments comprises a memory array region, a memory selecting region adjacent to the memory array region, a semiconductor gate electrode, a semiconductor channel connecting to the semiconductor gate electrode, a gate dielectric layer, a gate electrode layer, and channel layer. The gate electrode layer and the semiconductor channel are in the memory selecting region. The gate electrode layer and the semiconductor channel are separated from each other by the gate dielectric layer. The channel layer and the semiconductor gate electrode are in the memory array region. The channel layer and the semiconductor gate electrode are separated from each other by the gate dielectric layer.
Public/Granted literature
- US20170323896A1 MEMORY STRUCTURE AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2017-11-09
Information query
IPC分类: