Invention Grant
- Patent Title: Short contact in a testing apparatus for wireless integrated circuits
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Application No.: US14855341Application Date: 2015-09-15
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Publication No.: US10018652B2Publication Date: 2018-07-10
- Inventor: Wei Kuong Foong , Kok Sing Goh , Shamal Mundiyath , Eng Kiat Lee
- Applicant: JF MICROTECHNOLOGY SDN. BHD.
- Applicant Address: MY Petaling Jaya
- Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee Address: MY Petaling Jaya
- Agency: Maschoff Brennan
- Priority: MYPI2014002670 20140917
- Main IPC: G01R1/04
- IPC: G01R1/04 ; G01R31/28 ; H01R12/70 ; H01R13/24 ; H05K7/10

Abstract:
An electrical contact for use in an integrated circuit testing apparatus with a very short conducting contact pin. The shortness of the contact pin is made possible due to the unique design and coupling of the contact pin with an elastomer, and both supported by a housing in such a way that the contact pin test height is brought down to 0.5 mm, while providing a deflection of 0.1 mm with is sufficient in order to provide adequate penetration to matte tin plated devices. The contact pin of this invention looks almost like the letter “F”, rotated 90° to the left, so that it lies on its left side. The rectangular shaped elastomer is placed between the prongs of the “F”. The bottom part of the “F” is curved upwards so that it is almost parallel to the prongs.
Public/Granted literature
- US20160079707A1 SHORT CONTACT IN A TESTING APPARATUS FOR WIRELESS INTEGRATED CIRCUITS Public/Granted day:2016-03-17
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