Invention Grant
- Patent Title: Hot melt adhesive composition
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Application No.: US15505398Application Date: 2015-08-20
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Publication No.: US10023771B2Publication Date: 2018-07-17
- Inventor: Yi Jin , Kim Walton , Gary Marchand , Selim Yalvac , Allan W. McLennaghan , Kate Brown , Carl Iverson , Cynthia Rickey
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Husch Blackwell LLP
- International Application: PCT/US2015/046094 WO 20150820
- International Announcement: WO2016/029006 WO 20160225
- Main IPC: C08F10/06
- IPC: C08F10/06 ; C09J123/12 ; C09J123/16 ; C09J11/06 ; C09J11/08 ; C08K5/00 ; C08L91/06 ; C08K5/103

Abstract:
The present disclosure provides a composition. In an embodiment an adhesive composition is provided and includes A) a propylene based plastomer or elastomer (PBPE) comprising up to 10 wt % units derived from ethylene and having (i) a Koenig B-value less than 1.0; (ii) a total unsaturation per mole of propylene from 0.01% to 0.03%; (iii) a density from 0.870 g/cc to 0.890 g/cc; (iv) a melt viscosity at 177° C. from 800 mPa·s to 11,000 mPa·s; and (v) a weight average molecular weight from 20,000 to 50,000 g/mol; B) a tackifier; and C) a wax.
Public/Granted literature
- US20170247584A1 Hot Melt Adhesive Composition Public/Granted day:2017-08-31
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