Invention Grant
- Patent Title: Methods and compositions for processing dielectric substrate
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Application No.: US15207973Application Date: 2016-07-12
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Publication No.: US10029345B2Publication Date: 2018-07-24
- Inventor: Viet Lam , Ji Cui
- Applicant: Cabot Microelectronics Corporation
- Applicant Address: US IL Aurora
- Assignee: Cabot Microelectronics Corporation
- Current Assignee: Cabot Microelectronics Corporation
- Current Assignee Address: US IL Aurora
- Agent Thomas Omholt; Erika S. Wilson; Francis J. Koszyk
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; B24B37/04 ; C09G1/02
Abstract:
Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka “slurry”) and an abrasive pad, e.g., CMP processing.
Public/Granted literature
- US20170014969A1 METHODS AND COMPOSITIONS FOR PROCESSING DIELECTRIC SUBSTRATE Public/Granted day:2017-01-19
Information query
IPC分类:
