Invention Grant
- Patent Title: Heat module
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Application No.: US14629874Application Date: 2015-02-24
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Publication No.: US10030671B2Publication Date: 2018-07-24
- Inventor: Takehito Tamaoka , Kazuhiko Fukushima , Koji Hatanaka
- Applicant: Nidec Corporation
- Applicant Address: JP Kyoto
- Assignee: NIDEC CORPORATION
- Current Assignee: NIDEC CORPORATION
- Current Assignee Address: JP Kyoto
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2014-138168 20140704
- Main IPC: F04D29/58
- IPC: F04D29/58 ; F04D19/00 ; F04D25/06 ; F04D17/16 ; F04D29/42 ; H05K7/20 ; H01L23/427 ; G06F1/20

Abstract:
The fan includes an impeller, a motor, and a housing. The housing includes a side wall portion and a lower plate portion. at least one of the lower plate portion and an upper plate portion arranged to cover an upper side of the impeller includes an air inlet. The upper plate portion, the side wall portion, and the lower plate portion are arranged to together define an air outlet on a lateral side of the impeller. At or near an opposite end of the heat pipe, the heat pipe includes a contact portion arranged to be in contact with one of an upper surface of the lower plate portion and a lower surface of the upper plate portion. A longitudinal direction of at least a portion of the heat pipe extends at an angle with respect to the air outlet.
Public/Granted literature
- US20160003261A1 HEAT MODULE Public/Granted day:2016-01-07
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