- Patent Title: Compressible layer with integrated bridge in IC testing apparatus
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Application No.: US14567867Application Date: 2014-12-11
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Publication No.: US10031163B2Publication Date: 2018-07-24
- Inventor: Wei Kuong Foong , Kok Sing Goh , Shamal Mundiyath , Eng Kiat Lee
- Applicant: JF Microtechnology Sdn. Bhd.
- Applicant Address: MY Petaling Jaya
- Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee: JF MICROTECHNOLOGY SDN. BHD.
- Current Assignee Address: MY Petaling Jaya
- Agency: Maschoff Brennan
- Priority: MY2013004546 20131218
- Main IPC: G01R3/00
- IPC: G01R3/00 ; G01R1/067 ; G01R1/073

Abstract:
An electrical contact that employs a common compressible layer for all contacts, wherein the compressible layer is fashioned with ducts that contain bridges within them. The bridges are formed of the compressible layer. This bridge serves as a compressible member for a first and second member in electrical contact with each other, and that interact with each other such that a compression force acted on the first and second members will cause them to maintain electrical contact while compressing the bridge. When the compressive force is released, the bridge, acting like a spring, expands thus pushing the first and second members apart, but still in electrical contact with each other.
Public/Granted literature
- US20150168451A1 COMPRESSIBLE LAYER WITH INTEGRATED BRIDGE IN IC TESTING APPARATUS Public/Granted day:2015-06-18
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