A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.