公开(公告)号：US09691710B1

公开(公告)日：2017-06-27

申请号：US14959768

申请日：2015-12-04

Applicant: CYNTEC CO., LTD.

Inventor： Joseph D. S. Deng ,  Chia-Hsien Shen ,  Shu-Wei Chang ,  Kuan-Chih Huang

IPC: H01L21/00 ,  H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

公开(公告)号：US10037951B2

公开(公告)日：2018-07-31

申请号：US15363652

申请日：2016-11-29

Applicant: CYNTEC CO., LTD.

Inventor： Chia-Hsien Shen ,  Kuan-Chih Huang ,  Shu-Wei Chang ,  Joseph D. S. Deng

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.