公开(公告)号：US10438907B2

公开(公告)日：2019-10-08

申请号：US15375146

申请日：2016-12-11

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Fu Hu ,  Chih-Yu Hu ,  Shu-Wei Chang

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L21/56 ,  H01L23/50

Abstract: The present invention discloses a wireless package with a resilient connector for connecting a substrate to an antenna. The antenna is disposed directly on a top surface of a molding compound of the wireless package. The resilient connector has a lower terminal bonded to the substrate, a horizontal contact portion, and an oblique support portion integrally extending between the horizontal contact portion and the lower terminal. The horizontal contact portion has a flat top surface that is coplanar with the top surface of the molding compound and is in direct contact with the antenna such that the contact resistance distribution is concentrated and the production yield of the wireless package is improved.

公开(公告)号：US20180166404A1

公开(公告)日：2018-06-14

申请号：US15375146

申请日：2016-12-11

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Fu Hu ,  Chih-Yu Hu ,  Shu-Wei Chang

IPC: H01L23/66 ,  H01L23/498 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L23/50

Abstract: A wireless package includes a package substrate, a RFIC chip, a resilient connector, a molding compound encapsulating the RFIC chip, the resilient connector, and the top surface of the package substrate, and an antenna disposed on a top surface of the molding compound. The resilient connector has a terminal bonded to a pad on the top surface of the package substrate, a horizontal contact portion, and an oblique support portion integrally coupled to the horizontal contact portion and extending between the horizontal contact portion and the terminal. The antenna is in direct contact with the horizontal contact portion.

公开(公告)号：US09691710B1

公开(公告)日：2017-06-27

申请号：US14959768

申请日：2015-12-04

Applicant: CYNTEC CO., LTD.

Inventor： Joseph D. S. Deng ,  Chia-Hsien Shen ,  Shu-Wei Chang ,  Kuan-Chih Huang

IPC: H01L21/00 ,  H01L23/552 ,  H01L23/66 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4853 ,  H01L21/561 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/97 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2224/81

Abstract: A semiconductor package includes a substrate, a plurality of pin pads, a radio frequency (RF) pad, a semiconductor component, at least one surface mount device (SMD) component, a mold compound, a printed circuit board (PCB) antenna and a conductive solder. The RF pad is used to receive or transmit an RF signal on the top side of the substrate. The SMD component is mounted on the RF pad. The mold compound on the top side of the substrate covers the semiconductor component and the SMD component. The PCB antenna is located on the mold compound. Wherein, the conductive solder and the SMD component are stacked between the RF pad and a feeding structure of the PCB antenna.

公开(公告)号：US10037951B2

公开(公告)日：2018-07-31

申请号：US15363652

申请日：2016-11-29

Applicant: CYNTEC CO., LTD.

Inventor： Chia-Hsien Shen ,  Kuan-Chih Huang ,  Shu-Wei Chang ,  Joseph D. S. Deng

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56 ,  H01L21/683

CPC classification number: H01L23/66 ,  H01L21/56 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/17 ,  H01L24/81 ,  H01L2221/68359 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: A semiconductor package includes a radio frequency (RF) module, an antenna, an electromagnetic (EM) shield and a first mold body. The RF module having a bottom and a lateral side, wherein, the RF module includes a module board at the bottom. The antenna located at the lateral side of the RF module. The EM shield covering the RF module, wherein the EM shield includes a side wall disposed along the lateral side of the RF module, and the side wall of the EM shield is between the RF module and the antenna. The first mold body fixing the EM shield and the antenna, such that the antenna is spaced apart from the side wall of the EM shield by a predetermined distance.