A display system is disclosed. The display system comprises a light emitting diode (LED) device and a backplane (BP) device. The LED device comprises a plurality of LEDs having LED terminals. An LED bonding surface comprising a dielectric layer with LED bonding surface contact pads is coupled to diode terminals of the LEDs. The backplane (BP) device comprises a BP substrate having top and bottom surfaces. A plurality of system on chip (SoC) chips are bonded to chip pads disposed on a bottom surface of the BP device. The SoC chips are electrically coupled to the CMOS components of the BP device and LEDs of the LED device.