Invention Grant
- Patent Title: Semiconductor devices including dummy chips
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Application No.: US14730231Application Date: 2015-06-03
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Publication No.: US10043769B2Publication Date: 2018-08-07
- Inventor: Shing-Yih Shih , Neng-Tai Shih
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/683 ; H01L25/065 ; H01L23/31 ; H01L21/56 ; H01L23/498 ; H01L21/48 ; H01L23/29 ; H01L25/00
Abstract:
A semiconductor device includes an interposer having a first side and a second side opposite to the first side, at least one active chip mounted on the first side within a chip mounting area through a plurality of first bumps, at least one dummy chip mounted on the first side within a peripheral area being adjacent to the chip mounting area, a molding compound disposed on the first side. The molding compound covers the at least one active chip and the at least one dummy chip. A plurality of solder bumps is mounted on the second side.
Public/Granted literature
- US20160358865A1 WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF Public/Granted day:2016-12-08
Information query
IPC分类:
