Invention Grant
- Patent Title: Methods and apparatus for uniformly and high-rate depositing low resistivity microcrystalline silicon films for display devices
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Application No.: US15256054Application Date: 2016-09-02
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Publication No.: US10047440B2Publication Date: 2018-08-14
- Inventor: Shuran Sheng , Su Ho Cho
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/52
- IPC: C23C16/52 ; H01L21/02 ; C23C16/24 ; C23C16/455 ; C23C16/515 ; C23C16/509 ; H01J37/32

Abstract:
The present disclosure generally relates to an improved method for forming low resistivity crystalline silicon films for display devices. The processing chamber in which the low resistivity crystalline silicon film is formed is pressurized to a predetermined pressure and a radio frequency power at a predetermined power level is delivered to the processing chamber. In addition, feeding locations of one or more VHF power generator and controlling of each VHF power generator via phase modulation and sweeping allows for plasma uniformity improvements by compensating for the non-uniformity of the thin film patterns produced by the chamber, due to the standing wave effect. Diffuser plate having two curved surfaces helps improve crystallinity uniformity.
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