Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US15794416Application Date: 2017-10-26
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Publication No.: US10047441B2Publication Date: 2018-08-14
- Inventor: Masahiko Harumoto , Tadashi Miyagi , Yukihiko Inagaki , Koji Kaneyama
- Applicant: SCREEN Semiconductor Solutions Co., Ltd.
- Applicant Address: JP
- Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee: SCREEN Semiconductor Solutions Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2012-159917 20120718
- Main IPC: G03D5/00
- IPC: G03D5/00 ; C23C16/56 ; H01J37/02 ; B05C11/00 ; H01L21/033 ; G03F7/32 ; G03F7/20 ; C23C16/02 ; G03F7/30 ; G03F7/16 ; G03F7/00 ; H01L21/67
Abstract:
An underlayer is formed to cover the upper surface of a substrate and a guide pattern is formed on the underlayer. A DSA film constituted by two types of polymers is formed in a region on the underlayer where the guide pattern is not formed. Thermal processing is performed while a solvent is supplied to the DSA film on the substrate. Thus, a microphase separation of the DSA film occurs. As a result, patterns made of the one polymer and patterns made of another polymer are formed. Exposure processing and development processing are performed in this order on the DSA film after the microphase separation such that the patterns made of another polymer are removed.
Public/Granted literature
- US20180044795A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2018-02-15
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