Invention Grant
- Patent Title: Controller-PHY connection using intra-chip SerDes
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Application No.: US15367071Application Date: 2016-12-01
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Publication No.: US10049067B2Publication Date: 2018-08-14
- Inventor: Xiaohua Kong , Deqiang Song , Zhi Zhu , Ohjoon Kwon
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Haynes and Boone, LLP
- Main IPC: G06F13/38
- IPC: G06F13/38 ; G06F13/42 ; G06F3/14
Abstract:
An on-chip passive transmission channel is provided for the propagation of serialized data from a first controller to a dual-protocol physical layer interface. A second controller for the dual-protocol physical layer interface is located closer on a semiconductor die to the dual-protocol physical layer interface than the first controller.
Public/Granted literature
- US20180157609A1 CONTROLLER-PHY CONNECTION USING INTRA-CHIP SERDES Public/Granted day:2018-06-07
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