Invention Grant
- Patent Title: Method for manufacturing semiconductor device
-
Application No.: US15664106Application Date: 2017-07-31
-
Publication No.: US10050132B2Publication Date: 2018-08-14
- Inventor: Shunpei Yamazaki , Akihisa Shimomura , Yasumasa Yamane , Yuhei Sato , Tetsuhiro Tanaka , Masashi Tsubuku , Toshihiko Takeuchi , Ryo Tokumaru , Mitsuhiro Ichijo , Satoshi Toriumi , Takashi Ohtsuki , Toshiya Endo
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2013-267525 20131225
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/66 ; H01L21/02 ; H01L29/786

Abstract:
A change in electrical characteristics is suppressed and reliability in a semiconductor device using a transistor including an oxide semiconductor is improved. One feature resides in forming an oxide semiconductor film over an oxygen-introduced insulating film, and then forming the source and drain electrodes with an antioxidant film thereunder. Here, in the antioxidant film, the width of a region overlapping with the source and drain electrodes is longer than the width of a region not overlapping with them. The transistor formed as such has less defects in the channel region, which will improve reliability of the semiconductor device.
Public/Granted literature
- US20170352746A1 SEMICONDUCTOR DEVICE Public/Granted day:2017-12-07
Information query
IPC分类: