Invention Grant
- Patent Title: Method of manufacturing light emitting device
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Application No.: US15851459Application Date: 2017-12-21
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Publication No.: US10050182B2Publication Date: 2018-08-14
- Inventor: Takaaki Tada , Takayoshi Wakaki
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Foley & Lardner LLP
- Priority: JP2015-239332 20151208; JP2016-223139 20161116
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/44 ; H01L33/58

Abstract:
A light emitting device includes: a light emitting element including: a semiconductor structure including an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, each containing a nitride semiconductor, a p-electrode disposed on a portion of a surface of the p-type semiconductor layer on a side opposite to a surface provided with the active layer, and an n-electrode disposed on a surface of the n-type semiconductor layer on a side opposite to a surface provided with the active layer in a region other than a region facing the p-electrode; and a protective film continuously covering a surface of the n-electrode and a surface of the n-type semiconductor layer. The protective film includes a first metal oxide film and a second metal oxide film that are alternately layered, the first metal oxide film containing a first metal, and the second metal oxide film containing a second metal.
Public/Granted literature
- US20180114882A1 METHOD OF MANUFACTURING LIGHT EMITTING DEVICE Public/Granted day:2018-04-26
Information query
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